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| HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6713 Issued Date : 1993.01.13 Revised Date : 2002.05.07 Page No. : 1/4 HTIP127 PNP EPITAXIAL PLANAR TRANSISTOR Description The HTIP127 is designed for use in general purpose amplifier and lowspeed switching applications. Absolute Maximum Ratings (Ta=25C) TO-220 * Maximum Temperatures Storage Temperature ........................................................................................................ -55 ~ +150 C Junction Temperature ................................................................................................ +150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Tc=25C)................................................................................................. 65 W Total Power Dissipation (Ta=25C)................................................................................................... 2 W * Maximum Voltages and Currents BVCBO Collector to Base Voltage ............................................................................................... -100 V BVCEO Collector to Emitter Voltage ............................................................................................ -100 V BVEBO Emitter to Base Voltage ...................................................................................................... -5 V IC Collector Current ......................................................................................................................... -5 A Characteristics (Ta=25C) Symbol BVCBO *BVCEO ICBO ICEO IEBO *VCE(sat)1 *VCE(sat)2 *VBE(on) *hFE1 *hFE2 Cob Min. -100 -100 1 1 Typ. Max. -200 -500 -2 -2 -4 -2.5 300 Unit V V uA uA mA V V V K K PF Test Conditions IC=-1mA, IE=0 IC=-100mA, IB=0 VCB=-100V VCE=-50V VEB=-5V IC=-3A, IB=-12mA IC=-5A, IB=-20mA IC=-3A, VCE=-3V IC=-500mA, VCE=-3V IC=-3A, VCE=-3V VCB=-10V, f=0.1MHz *Pulse Test: Pulse Width 380us, Duty Cycle2% Darlington Schematic C B R1 R2 E HTIP127 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 100000 100000 Spec. No. : HE6713 Issued Date : 1993.01.13 Revised Date : 2002.05.07 Page No. : 2/4 Current Gain & Collector Current 10000 10000 hFE 1000 25 C o 75 C o hFE 125 C o 125 C 1000 75 C 25 C o o o 100 hFE @ VCE=3V 100 hFE @ VCE=4V 10 1 10 100 1000 10000 10 1 10 100 1000 10000 Collector Current-IC (mA) Collector Current-IC (mA) Saturation Voltage & Collcetor Current 10000 10000 Saturation Voltage & Colltctor Current Saturation Voltage (mV) Saturation Voltage (mV) 75 C 1000 25 C o o 75 C 1000 25 C o o 125 C o VCE(sat) @ IC=250IB 125 C o VCE(sat) @ IC=100IB 100 100 1000 10000 100 100 1000 10000 Collector Current-IC (mA) Collector Current-IC (mA) ON Voltage & Collector Current 10000 Switching Time & Collector Current 10 VCC=30V, IC=250IB1=-250IB2 75 C 25 C 1000 o o Swiching Times (us).. . ON Voltage (mV) Tstg 1 Tf Ton 125 C VBE(ON) @ VCE=3V o 100 1 10 100 1000 10000 0.1 1 10 Collector Current-IC (mA) Collector Current-IC (A) HTIP127 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6713 Issued Date : 1993.01.13 Revised Date : 2002.05.07 Page No. : 3/4 Capacitance & Reverse-Biased Voltage 1000 100000 PT=1ms PT=100ms 10000 Safe Operating Area Collector Current-IC (mA) Capacitance (pF) PT=1s 1000 100 Cob 100 10 10 0.1 1 10 100 1 1 10 100 Reverse-Biased Votage (V) Forward Voltage-VCE (V) HTIP127 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-220AB Dimension Marking: A D B E C Date Code Spec. No. : HE6713 Issued Date : 1993.01.13 Revised Date : 2002.05.07 Page No. : 4/4 H 127 TIP Control Code H I G 4 P M 3 2 1 N K Style: Pin 1.Base 2.Collector 3.Emitter O 3-Lead TO-220AB Plastic Package HSMC Package Code: E *: Typical DIM A B C D E G H Inches Min. Max. 0.2197 0.2949 0.3299 0.3504 0.1732 0.185 0.0453 0.0547 0.0138 0.0236 0.3803 0.4047 *0.6398 Millimeters Min. Max. 5.58 7.49 8.38 8.90 4.40 4.70 1.15 1.39 0.35 0.60 9.66 10.28 *16.25 DIM I K M N O P Inches Min. Max. *0.1508 0.0295 0.0374 0.0449 0.0551 *0.1000 0.5000 0.5618 0.5701 0.6248 Millimeters Min. Max. *3.83 0.75 0.95 1.14 1.40 *2.54 12.70 14.27 14.48 15.87 Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: * Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: * Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HTIP127 HSMC Product Specification |
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